Duocel® Silicon Carbide Foam
Characteristics:
- Low Density
- High Strength to Weight Ratio
- High Surface area to Volume Ratio
- isotropic load response
- controlled stress-strain Characteristics
General Properties
| Density | 4-30+% |
| Max Compression | Up to 25x |
| PPI Available | 5, 10, 20, 30, 45, 60, 80, 100 |
| Largest starting material sizes: | 8"x12"x24"* |
*Uncompressed Click on a property for more info |
|
Why is Duocel® silicon carbide foam so special?
The matrix of cells and ligaments is completely repeatable, regular, and uniform throughout the entirety of the material. Duocel® silicon carbide (SiC) foam is a rigid, highly porous and permeable structure and has a controlled density of metal per unit volume.
Physical Characteristics of Duocel® Silicon Carbide Foam* (8% Nominal Density)
| Compression Strength | 200 psi | (1.38 MPa) |
| Flexural Strength | 400 psi | (2.76 MPa) |
| Shear Strength | 100 psi | (.69 MPa) |
| Mohs Hardness | 9 Mohs | |
| Young’s Modulus | 4 × 105 psi | (2.76 GPa) |
| Knoop Hardness (100gm) | 2500 | |
| Poisson’s Ratio | 0.22 | |
| Bulk Thermal Conductivity | ||
· 482°F (250°C) |
3.05 BTU/ft · hr · °F | (5.28 W/m · °C) |
· 1832°F (1000°C) |
1.07 BTU/ft · hr · °F | (1.85 W/m · °C) |
· 2642°F (1450°C) |
.77 BTU/ft · hr · °F | (1.34 W/m · °C) |
| Coefficient of Thermal Expansion | ||
· Room Temperature |
1.22 × 10-6 in/in · °F | (2.2 × 10-6 m/m · °C) |
· 392°F (200°C) |
2.06 × 10-6 in/in · °F | (3.7 × 10-6m/m · °C) |
· 932°F (500°C) |
2.56 × 10-6 in/in · °F | (4.6 × 10-6 m/m · °C) |
· 1292°F (700°C) |
2.72 × 10-6 in/in · °F | (4.9 × 10-6 m/m · °C) |
| Bulk Resistivity at Room Temperature | · 4 × 105 ohm · in | (1.016 × 105 ohm · cm) |
| Sublimation Point | 4892°F | (2700°C) |
| Max Continuous Use (Inert) | 3992°F | (2200°C) |
| Oxidation Resistance | 3002°F | (1650°C) |
*these values were derived from small samples where edge effects influenced the results. Larger samples having a minimum of 10-15 bubble diameter produce more general test results which are in better compliance with the equations.
More Information:
Duocel® silicon carbide (SiC) foam is a great thermal conductor at lower temperatures.
Please visit our thermal conductivity page in the technical data section for a more in depth explanation of how materials and properties effects the thermal conductivity of Duocel® foam.
Duocel® silicon carbide (SiC) foamcan be used in electrochemical processes that require low electrical and fluid flow resistance. This is in stark contrast to most ceramics, which do not conduct electricity. Duocel® SiC supplements its strength in this type of application with its increased ability to withstand extreme temperatures.
Please visit our electrical conductivity page in the technical data section for a more in depth explanation of how materials and properties effects the electrical conductivity of Duocel® foam.
Duocel® silicon carbide (SiC) foam can be made up to 1” thick at 100 PPI. Larger pore sizes can be made larger. Please contact us for more info.
Duocel® silicon carbide (SiC) foam resists oxidation up to 3002F. SiC also has high resistance to acid corrosion.
It has a hardness that reduces the mechanical wear of the surface of Duocel® SiC foam.
ERG does not sell foam as a raw bulk material, only as finished end item components.

