What are Waterless Two-Phase Direct-to-Chip(D2C) Cold Plates?

Waterless Two-Phase D2C Cold Plates are advanced liquid cooling solutions designed for high-performance computing systems. Instead of using traditional liquids, we recommend dielectric refrigerants such as R134a or R515b to efficiently extract heat from CPUs and GPUs.

At the heat source, the refrigerant naturally boils, changing from liquid to vapor. This phase change enables far greater heat transfer compared to conventional methods.

The turbulence created by our foam structure prevents thermal runaway due to dryout; when gas bubbles prevent fresh refrigerant from reaching hot surfaces. As a result, foam makes better use of the potential of the refrigerant through more complete boiling.

Our cold plates automatically manage thermal hot spots, delivering consistent, reliable, and high-capacity cooling performance for today’s most demanding server environments.

Performance and Efficiency

Harness up to 80% of the refrigerant’s boiling capacity for maximum efficiency
Dry-out: Turbulence prevents dry-out by continuously redistributing liquid across every surface
No Hot-Spots: Boiling at the hot spot increases heat transfer providing additional localized cooling
Unmatched Performance: 400 Watts CM²

Reliability and Sustainability

Turbulent fluid dynamics maintain uniform chip temperatures; no overheating, no downtime.
Waterless system virtually eliminates the risk of leaks
Dynamic Self-Regulation: Heat coefficients scale proportionally with load to maintain consistent temperature distribution

This two-phase mechanism offers several engineering advantages:

Self-regulating hot spot management through localized boiling at heat-dense regions.
High heat transfer coefficients that scale with increasing load, improving thermal uniformity.
Reduced pumping requirements since phase change, not bulk liquid flow, drives heat transport.
Reliable operation with a closed, waterless system that mitigates risk of leaks or corrosion.

By leveraging phase-change thermodynamics, waterless two-phase liquid cold plates enable scalable, energy-efficient cooling for next-generation data center and HPC environments.

See Duocel® in action — contact us to request a demo or performance analysis!

Partner with ERG Aerospace for innovative solutions that prioritize performance, sustainability, and integration.